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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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ASIC Design Services and Mentor to Hold Workshop on Thermal Analysis and DesignJuly 23, 2018 | Mentor, a Siemens business
Estimated reading time: 1 minute
ASIC Design Services and Mentor, a Siemens Business, will hold a free workshop on "Thermal Analysis and Design for Electronic Systems", to be presented by Michael Kasperski, a FloTHERM XT specialist, on July 24, 2018, in Stellenbosch, South Africa, and July 26, 2018, in Midrand, South Africa.
Insufficient cooling can result in schedule delays, low reliability, and increased product costs, especially in high-performance devices where components are densely packed into ever-smaller enclosures. Proper thermal management of the entire design space is essential to delivering on-time, on-budget, reliable electronic products. Understand the heating effects of package selection, PCB layout, and board structure within an enclosure with FloTHERM XT, voted Product of the Year by Electronic Products Magazine.
FloTHERM XT is a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process. We will show you how FloTHERM XT draws together the EDA and MCAD design flows, resulting in a cleaner, symbiotic design process and allowing the latest data to be shared easily and efficiently between relevant team members. Additionally, we will illustrate how the software can be used in practice to evolve designs from a concept stage all the way through to final design verification.
We will demonstrate how both thermal experts and design engineers take advantage of FloTHERM XT as they develop the best cooling strategy, while keeping pace with other design constraints and changes as the overall system design evolves.
For more information, click here.
Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs.
Intel Corp. (INTC) launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade.
Keysight, Intel Foundry Partner to Certify Electromagnetic Simulation Software for Intel 18A Process Technology02/22/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.
I-Connect007 has just released the latest episode of its podcast series, On the Line with..., which focuses on designing for reality in the electronics industry. In this episode, host Nolan Johnson talks with ASC Sunstone VP/Manager Matt Stevenson about CAD tool features and data formats that help designers make better decisions and transfer better designs to manufacturing.
Intel Foundry Services (IFS) and Cadence Design Systems, Inc. (Nasdaq: CDNS) announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery.