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Register Now for Mentor’s August 30 Panelization Webinar
August 10, 2018 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Register now for Mentor’s free monthly Advanced Technology Webinar Series, to be held August 30, 2018. The topic is Panelization with the Xpedition Flow.
Xpedition Fablink simplifies the process of creating a panel design. Driven by the PCB, users can keep panel data up to date and easily place multiple PCBs in one panel if necessary. Panel-level DRC checks ensure that panels are correct and ready to manufacture.
The presenter is Kyle Lake of Oasis Sales, formerly a corporate marketing engineer with Mentor.
What Attendees Will Learn
- Easily create a panel design using Xpedition FabLink from your PCB
- Import and array one, or multiple PCBs into your panel
- Quickly generate manufacturing documents
- Run panel-level DRC checks
Who Should Attend
- Hardware engineers
- PCB designers
Sign up now for this free webinar delivered by Oasis Sales and Trilogic.
Date
August 30, 2018
Time
8:30-9:30 am PST
Click here to register.
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