Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
August Issue of Design007 Magazine Available Now
August 15, 2018 | Andy Shaughnessy, Design007 MagazineEstimated reading time: Less than a minute
This month, in the August issue of Design007 Magazine, we unpack the intricacies of PCB packaging. Over the past 60 years, packages have continued to shrink. The transistor outline “metal cans” of the 1950s would look out of place today. Some packages are no bigger than the period at the end of this sentence, complete with their own “inhalation warning.”
Learn more in this month's issue of Design007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the PDF copy for future reference.
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