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Frontline Releases InPlan 5.5September 3, 2018 | Frontline PCB Solutions
Estimated reading time: 1 minute
Frontline released version 5.5 of InPlan(r) software-based automatic engineering system. According to Frontline, InPlan combines sophisticated engineering know-how with state-of-the-art pre-production planning tools to design the optimal manufacturing process for PCB jobs in a rapidly changing manufacturing environment. InPlan standardizes the engineer’s work, integrates with front end (CAM) and back end (ERP) systems and maintains an electronic knowledge base based on rules and electronic specs. In addition, the InPlan system enables engineering concurrency, multi-site operations, and outputs BOM, Traveler and CAM instructions.
Some key features an enhancements in InPlan 5.5 include:
Faster, More Advanced Panelization for Both Rigid and Flex Boards
Make your automatic panelization placement more efficient with InPlan’s major performance improvements for complex rigid boards and FPCs. With a new focus on multi-threading computation and maximized memory usage, runtimes can be dramatically reduced.
Speed Up and Simplify Multi-Zone Creation and Review
Zone creation is optimized for your flex board with an updated, intuitive interface that enhances and simplifies the process of comparing, creating, and reviewing multiple zones. This reducies mismatches between drawing and calculation.
Refined, Customizable Stackup Image for Improved Customer Communication
Give your customers exactly the information they need with a more flexible, customizable stackup image.
- Display a detailed summary of each zone with new headers and footers.
- Remove artificial gaps in the stackup image to give a more accurate view of the stackup layers.
- Present a richer flex stackup with features such as button plating, separate adhesives and polyamide, and custom displays.
Frontline PCB Solutions is the world leader in PCB CAM and Engineering software solutions, offering the only end-to-end preproduction solution in the industry, from design to manufacturing. Based in Rehovot, Israel, Frontline is a joint venture of two industry leaders, Orbotech and Mentor Graphics.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.