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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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iNEMI Forming New Eco-Impact Estimator Project
September 20, 2018 | iNEMIEstimated reading time: Less than a minute
The iNEMI Eco-Impact Estimator currently enables extremely efficient and accurate life cycle assessment (LCA) estimates for two key greenhouse gas emissions component categories: bare printed wiring boards and large integrated circuits. The Eco-Estimator mitigates the major obstacles of performing an LCA — complexity, skill required, expense and time.
iNEMI is organizing a Phase 3 of the Eco-Impact Estimator project to further leverage and expand its capabilities. It will be held on October 17, 2:00-3:00 p.m. EDT (U.S.). Phase 3 will greatly enhance the tool/framework for more general use, with the following proposed topics:
- Update and expand on the scope of ICT components covered
- Investigate inclusion of other environmental aspects such as energy and water usage
You are being invited to join this open industry webinar to discuss plans for this new project. To register, click here.
Suggested Items
INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates
06/18/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.
Webinar: INEMI Printed Circuit Board Roadmap
06/13/2025 | iNEMIJoin INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
06/09/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
INEMI Announces Board of Directors Election Results
04/16/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.