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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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iNEMI Forming New Eco-Impact Estimator Project
September 20, 2018 | iNEMIEstimated reading time: 1 minute
The iNEMI Eco-Impact Estimator currently enables extremely efficient and accurate life cycle assessment (LCA) estimates for two key greenhouse gas emissions component categories: bare printed wiring boards and large integrated circuits. The Eco-Estimator mitigates the major obstacles of performing an LCA — complexity, skill required, expense and time.
iNEMI is organizing a Phase 3 of the Eco-Impact Estimator project to further leverage and expand its capabilities. It will be held on October 17, 2:00-3:00 p.m. EDT (U.S.). Phase 3 will greatly enhance the tool/framework for more general use, with the following proposed topics:
- Update and expand on the scope of ICT components covered
- Investigate inclusion of other environmental aspects such as energy and water usage
You are being invited to join this open industry webinar to discuss plans for this new project. To register, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
08/26/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates
06/18/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.
Webinar: INEMI Printed Circuit Board Roadmap
06/13/2025 | iNEMIJoin INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
06/09/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.