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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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ExpressPCB Now Includes Gerber Conversions with Board OrdersSeptember 26, 2018 | ExpressPCB
Estimated reading time: 1 minute
ExpressPCB has announced the inclusion of Gerber Conversions in conjunction with customer board orders.
ExpressPCB provides engineers, hobbyists, and makers a one stop solution by combining PCB schematic and layout software, manufacturing, and other services for their customers.
“Our customers have asked for more affordable options for receiving Gerber files, and we listened. Now all the files necessary for manufacturing are provided to customers when board orders are completed, at no additional cost,” said Michael Hebda, ExpressPCB product manager
At ExpressPCB, we understand our user’s needs for flexibility and transparency in an ever changing design world. Our manufacturing services are geared to provide an affordable, high quality PCB option for engineers, and we feel this change allows flexibility to address the specialized requirements many projects need.
ExpressPCB has worked hard over the years to streamline processes to be as efficient as possible. This allows ExpressPCB to pass savings to their customers, supporting their mission to help Design Engineers quickly bring their ideas to life with their free CAD software and the lowest manufacturing cost possible. Time is money, so waiting weeks just to get prototype PCBs onto the test bench can have a huge impact on a project.
ExpressPCB is the established leader in providing software and manufacturing solutions for low cost and quick turnaround prototyping. With 20 years of experience in delivering easy to use PCB design software and high quality, on-time PCB prototypes, ExpressPCB is committed to improving the prototyping process for the design engineers.
ExpressPCB’s schematic and layout tools are simple and unencumbered by multiple layers of menus, options and settings that more advanced PCB Design suites require mastering before you even start on your design project.
If time is of the essence and there is a need to quickly turn out a prototype to get a project off the ground, then ExpressPCB is the only choice.
For more information about ExpressPCB’s PCB solutions, please click here.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.