-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Book Review: The Printed Circuit Board Designer’s Guide to… Producing the Perfect Data Package
November 5, 2018 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 2 minutes

Recently, a variety of PCB industry experts have noted that the quality of data packages received from customers has never been worse. One expert at an IPC conference expressed alarm that, by his estimate, less than 10% of data packages submitted to PCB fabricators were complete and error-free. Meanwhile, many designers will do anything to avoid communicating with board shops and prefer only to use email.
Over the years, many designers have asked Mark Thompson, CID+, engineering support at Prototron Circuits, to write down his thoughts on design data packages. Over the course of his career, Thompson has evaluated thousands of data packages and delivered numerous talks to designers and engineers about how to create the perfect package. In the spirit of “garbage in, garbage out,” data packages must be perfect to create quality boards. Learn all this and more in The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package!
PCB designers everywhere should read this book. Thompson’s valuable examples, tips, techniques, and tools could help save millions of dollars in scrapped boards by teaching designers how to think like a board fabricator. His insights will help eliminate common errors, such as missing NC drill files, drawings, and plating statuses, as well as count discrepancies, impedance callouts for traces that do not exist in the data, and much more.
Further, Mark explains which files are required for a great output package. He discusses some and simple tricks that can minimize the time your design spends in your board shop’s CAM department, such as eliminating IPC netlist errors, formatting files consistently, etc. Many of these issues could be minimized by a thorough design review of the output package before it is sent to the fabricator, and this book shows the designers how to do just that. There is also an excellent glossary and checklist at the end of the book.
What are you waiting for? If you are a PCB designer who wants to start saving your company time and money, and you’re serious about creating the best, most perfect data packages available today, do yourself a favor. Do not prepare another data package without first downloading and reading The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package. It’s simple—the better the package, the better the board.
Click here to download your free copy of The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package today!
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.