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Indium to Feature Soldering Materials for HIA and SiP at ELEXCON 2018
November 8, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its proven soldering materials for heterogeneous integration and assembly (HIA) and system-in-package (SiP) applications at the ELEXCON 2018, December 20-22 in Shenzhen, China.
Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record with more than 2 billon front-end module SiP devices manufactured in the last three years using the company’s materials.
From water-soluble to no-clean soldering solutions,
Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA and SiP applications.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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