Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Mentor's Web Seminar on HyperLynx DRC Safety Critical and Creepage Checks
December 21, 2018 | Mentor, a Siemens businessEstimated reading time: 1 minute
Mentor, a Siemens business, has announced an upcoming web sebinar on "HyperLynx DRC Safety Critical and Creepage Checks" on January 17, 2019 at 11:30 a.m. - 12:30 p.m. US/Eastern (convert to local time).
Safety is paramount when working with electronic systems so standards organizations mandate safety checks to prevent electrical discharge. Unfortunately, manual inspections are error-prone and they struggle to detect violations as PCB design becomes more complicated. Automating the process can detect hard-to-find errors and save weeks off your PCB design time.
About the Presenters:
Ernie Frohring
Sr. Applications Engineer
Trilogic, Inc.
Ernie joined Trilogic, Inc, a leader in design automation software sales and support, in 1994 after a 20 year career in electronic design and instrumentation, specializing in emulators and logic analyzers. Since then he has leveraged his knowledge of hardware instrumentation to become experienced in the software tools used for electronic design. He has worked with various PCB layout, schematic capture, analog simulation, and signal integrity analysis tools, and is especially interested in the integration of these tools into a design environment. He currently specializes in high speed design, teaching classes, doing presentations, and working one-on-one with customers using the EDA tools from Mentor Graphics.
He graduated from Massachusetts Institute of Technology in 1973 with Bachelor's & Master's degrees in Electrical Engineering. His hobbies include chasing total solar eclipses to interesting parts of the world
Rory Riggs
Rory earned a BS EE from the University of Idaho in 2011 and continued on at UI for post graduate research. He joined Mentor Graphics soon after as an Associate Rotation Engineer, gaining experience as a Corporate Application Engineer in training. The Associate program focuses on supporting Mentor tool products DxDesigner, Xpedition and HyperLynx and ending with a project in Technical Marketing. After the rotation, Rory was hired as a Technical Marketing Engineer and has been there for 4 years at Mentor, A Siemens Business focusing on high-speed products as well as all PCB flow tools in the Electronic Board Systems portfolio.
Visit I-007eBooks to download your copies of Mentor’s books today: The Printed Circuit Designer’s Guide to… Signal Integrity and Power Integrity by Example.
Share on:
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.