Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Weak Microvia Interface Open Forum at IPC APEX EXPO
January 7, 2019 | IPCEstimated reading time: 1 minute
The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface.
The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it. Attendees will be invited to share their own issues regarding the weak microvia interface and will learn how to participate on the subcommittee.
IPC Weak Microvia Interface Open Forum
Wednesday, January 30
10:15 AM to 12:00 PM
San Diego Convention Center
Room 11A
Preliminary Agenda
1. Background: History of the effort, scope of work, status and organization
2. Presentation: Current Understanding of the Problem/Mitigation Measures
3. Weak Microvia Interface Project Subteam Reports
• Data Collation and Mining on the Issue
• FMEA “Fishbone”
• Engineering Simulation
4. Next Steps and Goals
• Near term: Breakout teams
• Middle term:
o Knowns/Unknowns: Can any intermediate conclusions or improved mitigation techniques be communicated?
o Identify Testing Needed: Gaps and confirmation
• Long term: Prevention: Can it be accomplished through design, process enhancements, etc.?
5. Q&A Session and How to Get Involved
The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed as a result of work done on IPC-WP-023. Order IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface from the IPC bookstore.
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.