-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Simberian to Demo Simbeor THz Software at DesignCon 2019
January 28, 2019 | Yuriy Shlepnev, SimberianEstimated reading time: 1 minute
Simberian Inc. will participate in the DesignCon 2019 conference and exhibition, January 29-31 at the Santa Clara Convention Center. Simberian will be presenting Simbeor THz electromagnetic signal integrity software, updated with distributed computing on the Linux platform, Simbeor SDK module with API for design automation in C/C++ and Matlab, and with completely automated post-layout de-compositional electromagnetic analysis.
The updated Simbeor THz is the industry-first tool with the validated automatic post-layout de-compositional electromagnetic analysis; almost all structures on test boards can now be simulated without manual adjustments. To accelerate pre- and post-layout electromagnetic analysis, Simbeor 3DML and 3DTF solvers in the updated Simbeor THz are parallelized on a loosely coupled grid of Linux computers available over internal, worldwide or cloud networks (only Windows version was previously supported). It further reduces the cost of PCB/packaging interconnect design.
The distributed computing on the Linux platform further reduces the cost of PCB/packaging interconnect design and strengthens Simbeor’s No. 1 position in the electromagnetic SI software price-performance category. Simbeor THz technologies are now available as Simbeor software development kit or Simbeor SDK.
Simberian’s technology and achievements are recognized at DesignCon 2019 with two nominations for the prestigious industry awards. The paper by A. Manukovsky, Y. Shlepnev, "Effect of PCB Fabrication Variations on Interconnect Loss, Delay, Impedance & Identified Material Models for 56-Gbps Interconnect Designs," co-authored by Intel and Simberian, has been chosen by the Technical Program Committee as a finalist for the DesignCon 2019 Best Paper Award. This marks the third time that Simberian’s founder Yuriy Shlepnev has been selected by the SI community as a finalist for the DesignCon Engineer of the Year Award.
Simbeor SDK provides API to solvers and tools and can be used for design automation with scripting in C/C++ and Matlab languages and as a component in other EDA tools. Simbeor THz, Simbeor Agent for Linux and Simbeor SDK are now available for customers and trials at www.simberian.com.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.