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February 2019 Issue of Design007 Magazine Available Now
February 26, 2019 | Andy Shaughnessy, Design007 MagazineEstimated reading time: Less than a minute
Technological advances have made it possible to print circuits on all sorts of traditional and non-traditional substrates, and even materials not even considered substrates. What does a PCB designer need to know in order to design circuits on these alternative materials?
The February 2019 issue of Design007 Magazine has the information you need to design PCBs in a world where everything's a substrate.
This month’s issue of Design007 Magazine is now on the virtual newsstand, and available for delivery in your e-mailbox each month. Subscribe through your my I-Connect007 membership.
For future reference, be sure to download the PDF version to your library.
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Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
10/13/2025 | Cadence Design Systems, Inc.The Cadence Giving Foundation today announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students with the skills, hands-on training and experience needed to excel in careers in artificial intelligence (AI).
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
10/14/2025 | Jesse Vaughan -- Column: Beyond the BoardIn the defense electronics sector, speed-to-market has shifted from being a commercial differentiator to a national security imperative. The ability to move from design concept to deployable system in months rather than years can provide the U.S. with important strategic advantages. Prototyping, once regarded as a costly and optional stage, has become the linchpin for accelerating program schedules while safeguarding performance, compliance, and mission reliability.
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.