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Fresh PCB Concepts: Engineering Copper Coin and Copper Pedestal Technology With IPC Design Interpretation

06/25/2026 | Team NCAB -- Column: Fresh PCB Concepts
Copper coin and copper pedestal technologies have become increasingly important in modern PCB design as thermal demands rise in power electronics, automotive systems, RF applications, aerospace electronics, and high-density computing environments. As component power density increases and board sizes shrink, traditional thermal management techniques often become insufficient to maintain acceptable operating temperatures and long-term reliability.

Principal Mineral Announces Acquisition of Isola and $280 Million in New Funding for Next Phase of Strategic Growth

06/16/2026 | Principal Mineral
Principal Mineral, a leader in rebuilding the industrial “missing midstream” of the global strategic materials supply chain, today announced the acquisition of Isola Group (“Isola”), a premier manufacturer of copper-clad laminates and dielectric prepregs used in printed circuit boards (PCBs). The transaction closed on June 16, 2026.

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

06/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

The AI Tipping Point: Transforming Global Material Supply Chains

06/01/2026 | Marcy LaRont, I-Connect007 Magazine
While the AI revolution has the world focused on the promise of solving our most complex challenges, some laminate and PCB fabricators are raising concerns that the high-performance materials used to build AI data centers will gobble up the precious resources needed to produce them. PCB industry expert Mark Goodwin, COO of Ventec International, a laminate and equipment supplier, has expressed his concerns about the critical shortage of glass and copper, which he believes will worsen.
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