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Mentor and Lamsim: 2018 DesignCon Best Paper Available Now
March 20, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
High-speed PCB designs are getting faster and faster. However, as the rate of GB/s increases, so too does the need to pay attention to material properties. Copper roughness, the area where the copper adheres to the laminate, is one of those properties. This 2018 DesignCon Best Paper award-winner describes a technique for increasing simulation accuracy through proper modeling of copper roughness.
This paper was written by Vladimir Dmitriev-Zdorov and Igor Kochikov of Mentor, a Siemens business, and Bert Simonovich of Lamsim Enterprises. To download this paper, click here.
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