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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Orange County Designers Council Chapter Meeting April 25April 10, 2019 | Scott McCurdy, Freedom CAD Services
Estimated reading time: 1 minute
The Orange County Chapter of the IPC Designers Council will hold a Lunch ‘n’ Learn event on April 25, 2019 in Irvine, California. Guest speaker Natasha Baker, CEO and founder of SnapEDA, will give a presentation titled The Top 5 Symbol & Footprint Mistakes That Even Professional Engineers Make.
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet even with rigid standards in place, mistakes inevitably creep into such a detail-oriented process.
Attendees will learn about the five mistakes that even professionals make when creating component libraries. Delving far beyond the basics, this presentation looks at the more gnarly errors that trip up engineers. For example, we all know to double-check our pin mappings, but what about how you’ve interpreted the component’s orientation in the datasheet?
Misinterpreting a component's top view for its bottom view is one of the top causes of faulty boards. Drawn from our community of 200,000 engineers, we hope that these lessons will prevent costly prototype iterations and delays on your next project.
Finally, attendees will learn how to prevent these errors on their next designs, by, for example, bringing more verification into your processes through checklists and other solutions.
Reserve a spot on your calendar on Thursday, April 25 from 11:30 am to 1:30 pm for this educational “Lunch ‘n Learn” event.
Thursday, April 25, 2019
11:30 am - 1:30 pm
Harvard Athletic Park (The multi-purpose room is at the SOUTH end of the athletic fields)
14701 Harvard Ave.
Irvine, California 92606
$10 at the door to help cover costs
Please RSVP no later than noon on Wednesday, April 24. There are two ways to RSVP:
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.