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Advanced Electronics Packaging Digest

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Draper Breaks Ground on New Microelectronics Building in Lowell

10/14/2026 | Draper Laboratory
Draper recently held a groundbreaking ceremony for a new microelectronics building in Lowell, Massachusetts. The building will house Draper's Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center.  

ComEd, Richardson Electronics Expand Illinois Battery Storage Project

10/14/2026 | Richardson Electronics, Ltd.
ComEd and Richardson Electronics, Ltd. joined state and industry leaders to announce Richardson Electronics’ expanded manufacturing of locally produced battery energy storage systems and plans to install its first onsite battery energy storage system demonstration project.

LITEON September Sales Rise 22% on Strong AI and Cloud Demand

10/14/2026 | LITEON Technology
LITEON’s consolidated revenue for September reached NT$18.8 billion, representing a 22% Y-o-Y increase.

Sypris Receives Follow-On Award for Mission-Critical U.S. Navy Program Share

10/14/2026 | Sypris Electronics LLC
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on award to manufacture and test electronic power supplies for a large, mission-critical U.S. Navy program.

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.
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