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IPC Study: How PCB Makers Meet Technology DemandsMay 6, 2019 | IPC
Estimated reading time: 1 minute
PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.
Based on data from 74 companies worldwide, the 213-page report presents data on PCB technology and OEMs’ PCB requirements as of 2018, as well as OEMs’ use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.
The data on OEMs’ use of emerging technologies showed that more than half of those surveyed are currently making products that communicate with the Internet of Things and three quarters make products that depend upon sensor inputs. By 2023, more than half of the reporting OEMs expect at least some of their products to incorporate artificial intelligence and more than one-third expect to make products that interface with humans via neural networks.
Interesting regional differences emerged on the use of blind vias, which are more commonly specified by OEMs in North America and Europe than in Asia. The use of stacked vias by PCB fabricators is also more prevalent in Asia today, but fabricators in all regions expect the use of stacked vias to grow, displacing staggered vias. Asian PCB fabricators are also leading the way in the use of printed electronics, which is expected to grow in all regions by 2023.
Data on board properties cover thickness, layer count, density, line width and spacing, via diameters, aspect ratios, I/O pitch, via design, blind and buried vias, and thermal properties. Use of materials looks at rigid, flexible, stretchable, metal core, loss characteristics and surface finishes. The PCB industry’s use of special structures covers embedded components and chip packages, and its use of printed electronics includes 3D printing and e-textiles. Survey participants’ comments on compliance and technical challenges and trends are included. In addition, the data in the report are segmented by two regions — North America and Europe in one segment, and Asia in another segment — and by two types of products — installed and mobile.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.