Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Cascade Chapter Designers Council Meeting is June 12
June 6, 2019 | IPC Designers Council, Cascade ChapterEstimated reading time: 1 minute
The Cascade Chapter of the IPC Designers Council will be meeting on June 12. This evening event is free, with dinner sponsored by Mentor. Don't miss out on this great educational opportunity to advance your knowledge and design skills.
The guest speaker is Robert Hanson, and electrical engineer and signal integrity design instructor. He will present Achieving Signal Integrity and Meeting EMI Radiation Requirements Using High-Speed Connectors.
Robert will be showing examples of connectors that have poor control of EMI radiation/immunity, which are also affected by mutual inductance and high signal reflection. Next, examples of adding ground pins will be shown that in turn enhance capability. The ground blade connector will be shown with different signal/ground pin configurations to show comparative transmission capabilities. Two widely used high-speed connectors for circuit cards and backplanes will be compared. A method to interface a connector to a land trace to eliminate reflections will follow. Finally, a connector that passed radiated emissions up to 500MHz will be discussed.
Date
Wednesday June 12, 2019
Time
6:00 - 8:00 pm
Location
Lake Washington Institute of Technology - Kirkland Campus. The meeting will be held in room A102 in the Southeast corner of the building on the 1st floor.
This event is free, but donations are greatly appreciated. Please RSVP no later than 8 p.m. on Tuesday, June 11.
To RSVP, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.