Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
HK Wentworth Appoints New Asia CEO
July 18, 2019 | HK WentworthEstimated reading time: 1 minute
The directors and shareholders of HK Wentworth Group, the parent company of both Electrolube and AF International, has announced the appointment of Sharon Zhang to the board of directors of HKW Beijing. Zhang, previously the general manager of HKW Beijing, will uphold her new title as chief executive officer and vice president of the Asian operation, with immediate effect.
The appointment complements HK Wentworth’s strategic objectives to expand its investment in people at a time of considerable growth within the company. Zhang has been actively involved in developing the Chinese and Asian customer bases at HKW Beijing. As part of her new role as CEO and vice president, Zhang will be responsible for actively maintaining these customer relationships, driving sales to develop the customer base further and increasing the company’s market share in the sale of conformal coatings, thermal management solutions, encapsulation resins, contact lubricants, cleaning solutions and service and maintenance aids.
Ron Jakeman, HK Wentworth’s managing director, comments, “Sharon has been vital to the growth of the Asian operation over the last 17 years. She has been instrumental in developing the Beijing-based manufacturing facility from its inception in 2002 and has also steered the successful development of our new state-of-the-art R&D facility in Suzhou. More recently, Sharon has managed the relocation process to a new factory in Zhuji, which has been newly commissioned. As a people and customer centred individual with a strong history of creating highly engaged teams, Sharon has successfully secured high levels of domestic business and has the experience to take our Asian operation to the next level of growth and development. We wish Sharon every success in her new role as CEO and vice president of Asia.”
Commenting on her new appointment, Sharon Zhang said, “Since joining HKW Beijing in 2002, I’ve really enjoyed the challenge, especially the provision of innovative electronics protection solutions for the Asian market and close collaboration with customers. China has undergone substantial growth and we are proud to offer a reliable manufacturing resource for customers. I am delighted to join the board of directors at HKW Beijing and begin my new role as CEO and vice president of the Asian operation. I hope to make even more of an impact at a very vibrant time in the company’s growth.”
For further information visit www.hkw.co.uk.
Share on:
Suggested Items
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.