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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Japan PCB Firms May Lose Ground in OLED Sector
September 6, 2019 | DigitimesEstimated reading time: 1 minute
Japan-based PCB makers are likely to be further marginalized if Apple's reportedly plans to launch three 5G iPhones all based on OLED technology are realized, according to sources from Taiwan's PCB supply chain.
Since the lamination of PCBs used in handset displays has been carried out through direct cooperation between PCB and display makers, the adoption of OLED for Apple's 5G phones—with the panels likely to be supplied mainly by Korea's display makers—means Korea's PCB firms would replace rival Japanese companies to become major PCB suppliers for OLED displays, said the sources.
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Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers
12/18/2025 | Team NCAB -- Column: Fresh PCB ConceptsWhen you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement.
Alpha Insights, Performance by Design: An Independent Perspective on the State of HDI Manufacturing
12/16/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignIn today’s electronics landscape—where routing densities continue to rise, and margin for error is shrinking—HDI fabrication has become a defining factor in whether products launch on time and perform as intended. Engineers and program teams now view HDI less as a specialty and more as a foundational requirement, particularly in sectors such as telecom, RF, aerospace, semiconductor test, medical devices, and advanced computing.
Driving Innovation: The Flash Cutting Process
12/08/2025 | Simon Khesin -- Column: Driving InnovationDuring the creation of a multilayer board, the lamination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consistency and size of this flash provide process engineers with valuable insight into lamination parameters, the flash itself must be completely removed before subsequent manufacturing steps.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.