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Suggested Items

The Solution Behind the Reliability: Selecting the Right LPM Material

06/19/2026 | LPMS USA
As low pressure molding (LPM) continues to gain adoption across automotive, medical, industrial, consumer, and outdoor electronics applications, LPMS USA is emphasizing the critical role material selection plays in ensuring long-term product reliability and performance.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/19/2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to...Design for Test, A Practical Guide to Test and Inspection, Chapter 1

06/04/2026 | I-Connect007
Over the last two to three decades, the electronics industry has experienced a significant transformation. Circuit card assembly (CCA) and printed circuit board (PCB) design have become highly automated and digitized, allowing for faster development and increased design reuse. Engineers can now easily build on existing, proven architectures. Despite these advancements, one key area often falls behind: test and inspection.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.
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