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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
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A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
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The Key to First-pass Success in PCB Design
April 10, 2025 | Gerry Partida, Summit InterconnectEstimated reading time: 1 minute

In the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase.
Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.
When issues surface late in the design cycle or during production, the costs of fixing them escalate exponentially. Redesigns, delays, and rework add unnecessary complexity and expense, while product reliability and time-to-market suffer. To avoid these challenges, collaboration needs to occur earlier in the design cycle, where issues can be proactively addressed.
Bridging the Knowledge Gap
PCB designers often focus on functionality, performance, and compliance with end-use requirements. Meanwhile, fabricators look at manufacturability, process efficiency, and cost optimization. Proactive collaboration between the OEM and the manufacturer ensures that requirements and capabilities are aligned from the outset, minimizing potential conflicts between design intent and fabrication results.
To read this entire article, which appeared in the March 2025 issue of Design007 Magazine, click here.
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Global Citizenship: Together for a Perfect PCB Solution
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The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.