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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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PCB Maker Apex Expects Shipments to Resume Growth in 2020
September 10, 2019 | DigitimesEstimated reading time: 1 minute
PCB maker Apex International expects a relatively weak second half of 2019 due to limited seasonal stimulus and the appreciation of the Thai currency affecting its revenues and profits from operations in Thailand. But the company eyes a significant turnaround starting in the first quarter 2020, when shipments of 10-layer PCBs for 8K TV application kick off.
The company said weakening shipment pull-in momentum from clients since August is dimming prospect for the remaining months of the year.
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Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Podcast Episode 2—AI Is Changing the Rules: Are Your PCB Materials Ready?
03/10/2026 | I-Connect007I-Connect007 announces the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics. In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
STMicroelectronics Completes Acquisition of NXP’s MEMS Business
02/03/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, completed the acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business.
MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics
01/27/2026 | I-Connect007The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.