Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Driving Innovation: Direct Imaging vs. Conventional Exposure

07/01/2025 | Simon Khesin -- Column: Driving Innovation
My first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.

Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines

06/30/2025 | Apollo Seiko
Apollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.

Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop

06/26/2025 | Indium
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A

Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices

06/26/2025 | Team NCAB -- Column: Fresh PCB Concepts
Micro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.

Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3

06/25/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Tin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in