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DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition

05/13/2024 | DuPont
DuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.

MKS’ Atotech, ESI to Participate in IPC APEX EXPO

03/29/2024 | MKS’ Atotech
MKS’ Atotech and ESI will participate in this year’s IPC APEX EXPO 2024, the PCB industry’s largest event in North America, to be held in Anaheim, California, to be held from April 6-11 2024 at the Anaheim California Convention Center.

Trouble in Your Tank: Electrodeposition of Copper, Part 6

02/08/2024 | Michael Carano -- Column: Trouble in Your Tank
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.

Trouble in Your Tank: Electrolytic Copper Plating, Part 5

01/10/2024 | Michael Carano -- Column: Trouble in Your Tank
In a previous column on the fundamentals of electrolytic copper plating of printed circuit boards, the subject matter covered the general function of organic addition agents and the role of these additives on the grain structure, plating uniformity, and physical properties of the subsequent copper deposit. Here, I will explore the many other critical plating parameters that influence throwing power, copper deposit thickness, and metallurgical properties. In a future column, I will explore the additives and their functionality in more detail.

I-Connect007 Columnist George Milad Passes Away

12/20/2023 | I-Connect007 Editorial Team
I-Connect007 columnist George Milad passed away on Dec. 7, 2023, at the age of 81. George was well-known in the PCB industry for his technical expertise in physical organic chemistry. He was employed as a national accounts manager at Uyemura International Corporation, was the author of the chapters on plating and surface finishing in Printed Circuit Handbook: Seventh Edition, and had a series of publications on electrolytic plating and metallic surface finishes.
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