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Last month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.

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Real Time with... productronica 2025: The Versatility of Electroplating Technology With GreenSource

12/01/2025 | Real Time with...productronica
Gustavo Ramos from GreenSource Engineering shares insights on an innovative electroplating module. This system features high current density and adaptable chemistry, making it suitable for a range of applications. The focus is on developing a flexible process that can handle various product mixes and technologies, enhancing efficiency and versatility in electroplating.
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