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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Register Now for Zuken’s DDR5 Webinar on Nov. 13
October 21, 2019 | ZukenEstimated reading time: Less than a minute
This webinar will explore a predictive, productive and insightful workflow to get to an optimal DDR5 design that performs to the target speed grade, reliably.
DDR5 is the latest generation of memory in development, doubling the peak data rate to 6400 MT/s (compared to DDR4). With great technical ambitions come much tighter specifications for system PCB designers, especially when faced with channel loss, skew, reflections and crosstalk, all of which become much more significant at higher frequencies. In fact, PCB design margins are so minimal that DDR5 introduces equalization on the commodity DRAM chips for the first time.
The presentation will begin with pre-layout simulation to explore design choices, then transition to constraint-based high-speed routing in Zuken CR-8000. The design will then be verified by electromagnetic simulation and system simulations in order to build confidence in the final DDR5 design.
Date/Time
November 13, 2 PM EST
Registration
To register for this event, or for more information, click here.
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