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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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AltiumLive 2019 Frankfurt – A Perfect Mix of Education and Fun
The AltiumLive PCB Design Summit in Frankfurt, Germany has come to a close, with Happy Holden's keynote signaling the end of this three-day event. I met designers and design engineers from Germany, France, Italy, the Netherlands, Sweden and Croatia, just to name a few. Lawrence Romine, Altium's VP of corporate marketing, estimated that the show drew about 300 PCB designers and design engineers.
The conference, at Frankfurt Airport Sheraton, started with University Day on Monday. The activities on Tuesday and Wednesday were built around keynote presentations by Rick Hartley, Carl Schattke, Jeremy Blum, and our own Happy Holden.
Tuesday night’s Robot Challenge was a riot; as Romine put it, “Nerds, beer and robots…what more can you ask for?”
Each night, a few dozen attendees would repair to the Sheraton’s sports bar and shoot pool or just hang out with other designers. I heard one designer say that the entire event was the perfect mix of education and fun.
I have to hand it to the Altium staff for pulling this off, especially considering that they only had one week in between the San Diego event and this one. I don’t know how they do it; how would you like to explain to TSA why you’re carrying a robot full of wires and servos? Altium hasn’t decided where next year’s European event will be held, but we’ll be there to cover it.
More Columns from The Shaughnessy Report
The Shaughnessy Report: A Stack of Advanced Packaging InfoThe Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders
The Shaughnessy Report: Mechatronics—Designers Need to Know It All
The Shaughnessy Report: All Together Now—The Value of Collaboration
The Shaughnessy Report: Unlock Your High-speed Material Constraints