-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
The Shaughnessy Report
Column from: Andy Shaughnessy
Andy Shaughnessy is the co-editor of PCB007 Magazine, editor of PCBDesign007 and the Inside Design newsletter, as well as managing editor of Design007 Magazine. Andy has been covering PCB design and EDA issues since 1999. A former crime reporter, Andy previously served as editor of Printed Circuit Design & Manufacture and conference chair for the PCB Design Conferences. He is dedicated to making PCBDesign007 the top online source of information for PCB designers and design engineers.