Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
IDENTCO Receives Mexico Technology Award for Auto Apply Solutions
October 25, 2019 | IDENTCOEstimated reading time: 1 minute
IDENTCO announces that it was awarded a 2019 Mexico Technology Award in the category of Labeling for its Auto Apply Solutions. The award was presented to the company during a Wednesday, October 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
IDENTCO’s labeling and high-temperature masking system enables customers with SMT lines to print-on-demand miniature tracking labels and automatically apply those labels to their printed circuit boards and components using existing pick-and-place assets. A pre-printed label option also is available through IDENTCO’s print service bureaus in Germany, Chicago and Monterrey (MX). Additionally, the system can be used to automatically place high-temperature die-cut polyimide masks for selective solder masking.
IDENTCO offers the thinnest pick-and-place label presenter in the industry that is compatible with all major pick-and-place machines. High-performance labels and matching ribbons withstand the extreme temperatures and solvents used in the manufacture of surface-mount and through-hole printed circuit boards, providing traceability throughout the entire assembly process. Labels also are available with electro-static dissipative (ESD) properties to meet the requirements of ANSI/ESD S20.20.
The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers over the last 12 months.
About IDENTCO
Headquartered outside Chicago, IDENTCO has been delivering technology-driven, high-performance labeling solutions since 1986. We challenge ourselves to develop innovative solutions that can withstand any number of extremes and meet the strictest performance standards. With ISO-certified manufacturing facilities in the U.S., Mexico, and Germany, we have a global presence and local expertise. For more information, visit www.identco.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.