Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
IDENTCO Receives Mexico Technology Award for Auto Apply Solutions
October 25, 2019 | IDENTCOEstimated reading time: 1 minute
IDENTCO announces that it was awarded a 2019 Mexico Technology Award in the category of Labeling for its Auto Apply Solutions. The award was presented to the company during a Wednesday, October 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
IDENTCO’s labeling and high-temperature masking system enables customers with SMT lines to print-on-demand miniature tracking labels and automatically apply those labels to their printed circuit boards and components using existing pick-and-place assets. A pre-printed label option also is available through IDENTCO’s print service bureaus in Germany, Chicago and Monterrey (MX). Additionally, the system can be used to automatically place high-temperature die-cut polyimide masks for selective solder masking.
IDENTCO offers the thinnest pick-and-place label presenter in the industry that is compatible with all major pick-and-place machines. High-performance labels and matching ribbons withstand the extreme temperatures and solvents used in the manufacture of surface-mount and through-hole printed circuit boards, providing traceability throughout the entire assembly process. Labels also are available with electro-static dissipative (ESD) properties to meet the requirements of ANSI/ESD S20.20.
The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers over the last 12 months.
About IDENTCO
Headquartered outside Chicago, IDENTCO has been delivering technology-driven, high-performance labeling solutions since 1986. We challenge ourselves to develop innovative solutions that can withstand any number of extremes and meet the strictest performance standards. With ISO-certified manufacturing facilities in the U.S., Mexico, and Germany, we have a global presence and local expertise. For more information, visit www.identco.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.