-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Florida Poly to Boost Autonomous Vehicle Research with New Simulation
October 30, 2019 | PRNewswireEstimated reading time: 2 minutes

Florida Polytechnic University will soon have a new simulation facility on campus dedicated to the testing and verification of autonomous vehicle technology in real-time.
The National Science Foundation awarded the University a $350,000 grant that enables the development of a large-scale Hardware-in-the-Loop (HiL) simulation facility for connected and autonomous vehicles (CAVs). HiL simulation is a robust gateway for the development and testing of complex real-time embedded systems. The new lab should be operating by the beginning of the spring semester.
“I thank the National Science Foundation for their support of Florida Polytechnic University’s research and development of autonomous vehicle technology,” said Florida Sen. Marco Rubio. “Autonomous vehicle research is critical to the future of transportation in the state of Florida, and I look forward to Florida Poly’s continued leadership in this space.”
The HiL simulation facility will provide researchers from the Florida Poly’s Advanced Mobility Institute a more realistic approach to the testing and verification procedures, as they collaborate closely with students on practical and real-world projects related to CAVs. These include research on how autonomous vehicles operate independent of weather or electromagnetic interferences, while surrounded by non-verbal human communication such as gestures and signals.
“So far we’ve been working and generating different scenarios as models for Software-in-the-Loop testing, but only doing it with software is not as realistic,” said Dr. Arman Sargolzaei, assistant professor of electrical engineering and the grant’s lead investigator. “The new Hardware-in-the-Loop facility will allow us to do testing that is closer to real-world scenarios.”
According to Sargolzaei, Hardware-in-the-Loop implementation is a great step forward to achieving cost-efficient and safe test procedures before migrating to road or test track experimentations.
“Advancing Hardware-in-the-Loop application domain to the era of CAVs will lead to a set of exemplary breakthroughs in the field of transportation research,” Sargolzaei said. “We are excited for the establishment of this new facility to accelerate our research mission, which is to make automated vehicle more safe and secure.”
In addition to Sargolzaei, other researchers collaborating on the grant’s research are Dr. Suleiman Alsweiss, Dr. Ala Alnaser, Dr. Jorge Vargas, Dr. Saleem Sahawneh, and Dr. Rahul Razdan from the Advanced Mobility Institute, and Dr. Mustafa Ilhan Akbas from Embry-Riddle Aeronautical University
Florida Poly has positioned itself as a leader in autonomous vehicle technology research. The Advanced Mobility Institute is the largest research effort in the country dedicated exclusively to the testing and verification of this emerging technology. It has developed partnerships with state, national, and international entities such as SunTrax, the Jacksonville Transportation Authority, and TalTech University in Estonia, among others.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.