Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
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Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Meet George Milad, I-Connect007 Columnist
October 31, 2019 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more.
George Milad has 30+ years of experience in PWB manufacturing and is the national accounts manager for technology at Uyemura International Corporation. He holds a master’s degree in physical organic chemistry from the American University in Washington, D.C., 1979, is the author of the chapters on plating and surface finishing in Printed Circuits Handbook: Seventh Edition, and has a series of publications on electrolytic plating and metallic surface finishes. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.
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