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Suggested Items

Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production

03/02/2026 | Kurt Palmer -- Column: Driving Innovation
In high-end electronics, complexity is often measured in microns. However, when those microns are spread across a massive surface area, the engineering challenge fundamentally changes. Imagine two panels: Both are highly complex, featuring 4-stage build-ups, 2-mil line and space patterns, 2-mil microvias, and through-holes with a demanding 1:30 aspect ratio.

Zhen Ding Holding and Topoint Technology Sign Strategic Cooperation Agreement

12/02/2025 | Zhen Ding Technology
Zhen Ding Tech. Group, the world’s largest PCB manufacturer, and Topoint Technology Co., Ltd., a global leader in precision drill bits and integrated drilling solutions, officially signed a strategic cooperation agreement at the Zen Ding Times Building in Shenzhen.

Simon Khesin: A PCB Journey of Familiar and Unfamiliar Paths

11/24/2025 | Marcy LaRont, PCB007 Magazine
In Driving Innovation, Simon Khesin shares his extraordinary path from Moscow engineer to global account manager at Schmoll Maschinen. His story spans risk, reinvention, and resilience—from designing drilling machines to starting over in Germany—and celebrates the freedom to create and the power of staying adaptable in a changing world.

Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling

11/04/2025 | Matt Stevenson -- Column: Connect the Dots
Ultra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.

Driving Innovation: Mastering Panel Warpage

09/23/2025 | Simon Khesin -- Column: Driving Innovation
During the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
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