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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Pluritec Takes Industry 4.0 to the Next Level
December 11, 2019 | Real Time with...productronicaEstimated reading time: Less than a minute
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Nicola Doria, president and CEO of Pluritec.
Editor Pete Starkey and Doria discuss some of the changes that have taken place at Pluritec over the past few years, from focusing on drilling and routing machines to becoming a company that provides an entire process solution, not just a machine. Doria explains why Pluritec has partnered with a variety of companies recently to help make this plan a reality. And as Doria says, all of the company’s machines can now communicate with each other as Pluritec continues to implement Industry 4.0.
The productronica event is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
Watch video below:
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Julia McCaffrey - NCAB GroupSuggested Items
Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production
03/02/2026 | Kurt Palmer -- Column: Driving InnovationIn high-end electronics, complexity is often measured in microns. However, when those microns are spread across a massive surface area, the engineering challenge fundamentally changes. Imagine two panels: Both are highly complex, featuring 4-stage build-ups, 2-mil line and space patterns, 2-mil microvias, and through-holes with a demanding 1:30 aspect ratio.
Zhen Ding Holding and Topoint Technology Sign Strategic Cooperation Agreement
12/02/2025 | Zhen Ding TechnologyZhen Ding Tech. Group, the world’s largest PCB manufacturer, and Topoint Technology Co., Ltd., a global leader in precision drill bits and integrated drilling solutions, officially signed a strategic cooperation agreement at the Zen Ding Times Building in Shenzhen.
Simon Khesin: A PCB Journey of Familiar and Unfamiliar Paths
11/24/2025 | Marcy LaRont, PCB007 MagazineIn Driving Innovation, Simon Khesin shares his extraordinary path from Moscow engineer to global account manager at Schmoll Maschinen. His story spans risk, reinvention, and resilience—from designing drilling machines to starting over in Germany—and celebrates the freedom to create and the power of staying adaptable in a changing world.
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
11/04/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.