Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
The Convergence of 5G and Automotive
January 8, 2020 | Barry Matties, I-Connect007Estimated reading time: 1 minute
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.
Barry Matties: How do you see the automotive market and 5G?
Karthik Vijay: These are two massive markets, and we are really excited to play in these verticals with innovative material sets. To put that in the automotive perspective, opportunities with powertrain electrification platforms (e.g., 48V, hybrid electric vehicles, electric vehicles) and advanced driver assist systems (ADAS) are exploding. The foundations of this work will facilitate the innovations for the full-electric driverless car of the future. That’s what is making it really exciting because I see this as a once in a 20–30-year opportunity. Automotive typically doesn’t adapt to new material sets that quickly, and rightfully so because there’s a lot of reliability testing and lifetime criticality that needs to be validated. That’s still happening, but the goalposts are changing pretty fast. With 5G, we are involved in various stages of the ecosystem right from the material sets inside the components to the base-stations used. To give you an example of the convergence of 5G and automotive, V2X is a core platform that will be facilitated by 5G. That means that the vehicle is connected to everything: vehicle-to-vehicle, vehicle-to-tower, vehicle-to-people, etc. As mentioned, both the automotive and 5G markets are open to innovation, and it is a great time to be involved with new material sets.
Matties: What opportunities are you seeing? Vijay: If you look at electrification, a direct consequence of moving up the electrification chain is increased service temperatures. Standard alloys like tin/silver/copper [SAC] are not going to make the cut, and there is an immediate opportunity for high-reliability solders in PCB assembly.
To read this entire interview, which appeared in the December 2019 issue of SMT007 Magazine, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.