Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
Elementary, Mr. Watson: Why Your PCB Looks Like a Studio Apartment
The Shaughnessy Report: A Plan for Floor Planning
DuPont Introduces New Pyralux and Riston Products
February 3, 2020 | DuPontEstimated reading time: 1 minute
DuPont Interconnect Solutions announced today that it is introducing several new products across its DuPont™ Pyralux® and Riston® product families to address a diverse set of needs for both the manufacture and performance of advanced electronics devices. DuPont will showcase these new products and many other innovations at the upcoming IPC APEX tradeshow in San Diego, California, Feb. 4-6, booth #4118.
“DuPont Interconnect Solutions is focused on helping our customers push performance boundaries, while also meeting complicated processing demands,” said Andy Kannurpatti, West Business Leader, DuPont Interconnect Solutions. “With the introduction of these newest products, we are demonstrating again our resolve to create novel solutions that meet the needs of our customers today and in the future.”
DuPont’s newest product innovations include:
- Pyralux® AG – an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
- Pyralux® GPL – an adhesive that is specifically formulated for high-speed, high-frequency flexible circuit applications; it has outstanding thermal resistance, peel strength and UV laser drilling process capability.
- Riston® DI3000 – multi-wavelength, dry-film photoresist for pattern plating on multi-layer boards. High adhesion and chemical resistance delivers yield by eliminating lifting and breakdown defects in copper, tin or gold.
- Riston® DI5100 – optimum solution for the mSAP process. Made for smooth copper high adhesion on isolated resist lines, this film delivers the ultimate high density circuits made today.
- Riston® DI9200 – high density interconnect film for print and etch process. High resolution and adhesion, combined with excellent lamination conformation, ensures high yields. Fast photospeed at multiple LDI wavelengths ensures high productivity.
DuPont Interconnect Solutions brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.
As a market leader in flexible PCB laminates, dry film photoresists and high-reliability metallization, we allow our customers to push the design envelope and create products that perform faster and more reliably.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
50% Copper Tariffs, 100% Chip Uncertainty, and a Truce
08/19/2025 | Andy Shaughnessy, I-Connect007If you’re like me, tariffs were not on your radar screen until a few months ago, but now political rhetoric has turned to presidential action. Tariffs are front-page news with major developments coming directly from the Oval Office. These are not typical times. President Donald Trump campaigned on tariff reform, and he’s now busy revamping America’s tariff policy.
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.