-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
NPL to Host Electronics Reliability Webinars
February 27, 2020 | NPLEstimated reading time: 2 minutes
NPL is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research. These FREE online webinars provide the opportunity to draw on years of practical experience without leaving your desk. To participate, you need a phone line and Internet access. Please note that registration is essential.
The majority of webinars run for 60 minutes and each one is limited to 100 delegate/company registrations. A copy of each of the slides presented and links to NPL reports will be provided after the webinar. In preparation for the event and to ensure you are equipped to gain the maximum benefit, please read our simple Webinar Guidelines.
A New Draft Standard for Condensation Testing Martin Wickham/Ling Zou
17th March 2020
2:30 PM - 4:00 PM GMT
Achieving high reliability in service is the key issue in today’s high-density electronics assemblies. Electrochemical reliability becomes more critical, as electronic circuits move to increased packaging densities, and are operated in harsher environments (hotter/damper/condensing). Contaminants and bias with moisture facilitate electrochemical corrosion processes that result in a loss of continuity or short circuit (failures) on electronic assemblies. Moisture plays an important role for circuit failure, and condensation will accelerate the failures.
The electronics industry uses a number of condensation tests developed by large OEMs. They all differ and it is challenging and costly for materials suppliers to test multiple materials across all condensation tests. Additionally, most of these standards are based on changing the environment around the test vehicle to create condensation and are therefore highly dependent on the thermal mass of the test vehicle and capability of the chamber being utilised.
NPL has been working with industrial partners on a collaborative project to develop a new approach to create controllable condensation on test vehicles. The temperature of the test vehicles can be directly depressed to any required level without disturbing the stable environmental condition. Different levels of condensation can be cycled to simulate condensation real world scenarios. Results will be presented based on a test assembly with a range of fine pitch components including QFNs, QFPs and chip capacitors. In a 48 hour SIR test, coated assemblies with different coating variables, were subjected to eight increasing levels of condensation from low to high. The condensation level where SIR values dropped below 100 M? can be used to score the protection performance of different combinations of coatings, application processes and components. A draft standard is now in preparation and an outline of the new standard will be given for industry comment.
Suggested Items
Solar Powered Aircraft Achieves New Stratospheric Success
12/26/2024 | BAE SystemsA British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession.
The Test Connection Inc. Doubles Annual Donation to Streets of Hope
12/26/2024 | SMTAThe Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its continued support for Streets of Hope, a Baltimore-based charity dedicated to providing food and shelter to men in need.
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Saki to Highlight Advanced Inspection Innovation at 39th NEPCON JAPAN
12/23/2024 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at the 39th NEPCON JAPAN at the Tokyo Big Site Exhibition Center.
Northrop Grumman Launches Black Dagger Target to Test New Patriot Missile System Sensor
12/20/2024 | Northrop GrummanNorthrop Grumman Corporation launched a Zombie target vehicle variation, known as “Black Dagger,” from Fort Wingate to White Sands Missile Range, New Mexico, for the U.S. Army Space and Missile Defense Command’s (USASMDC) LTZ-3 test mission. Zombie targets get their name because they bring “new life” to demilitarized solid rocket motors by repurposing them to create threat-representative tactical ballistic missiles.