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AIM to Participate at SMTA Dallas Expo & Tech Forum on March 24, 2020
March 10, 2020 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Dallas Expo and Tech Forum taking place on March 24, 2020 at the Plano Event Center in Plano, TX. AIM Solder will highlight its REL electronic solders.
REL22™ is an award-winning, high reliability alloy developed to address reliability and production quality issues common to similar multi-element alloys. Both internal and customer testing has proven that REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61™ is ideally suited for industries which require a cost effective alternative to SAC305 with no loss of processing performance or durability. REL61 provides significant advantages over other no-low silver alloys by offering better flow characteristics at lower temperatures, thus reducing PCB damage and assembly costs.
To discover all of AIM’s products and services, visit the company at the SMTA Dallas Chapter Expo and Tech Forum in stand # 200 for more information and to speak with one of AIM’s knowledgeable staff members.
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Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
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Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
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04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.