-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Postpones Upcoming Meetings Due to Coronavirus Response
March 17, 2020 | SMTAEstimated reading time: Less than a minute
Given the response and direction of government agencies and global health authorities, SMTA is directing all in-person meetings originally scheduled through Mid-May to be postponed or transitioned into an online format.
The health and safety of our participants and members is top priority at SMTA. We remain in regular contact with our venue managers, chapter teams, and professionals within the greater meeting planning industry.
For the most updated information about SMTA events, check our website or contact your local chapter.
Contact them directly with any questions or concerns. SMTA Headquarters: +1-952-920-7682
Suggested Items
KYZEN’s Adam Klett to Keynote at SMTA Electronics in Harsh Environments Conference
05/07/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced today that KYZEN’s Director of Science, Adam Klett, PhD will present as a keynote speaker at the SMTA Electronics in Harsh Environments Conference. The event is scheduled to take place May 14-16, 2024 at the Technical University of Denmark in Copenhagen, Denmark.
SMTA Long Island Chapter Celebrates 30th Anniversary with Membership Appreciation Event
04/25/2024 | SMTAThe Surface Mount Technology Association (SMTA) Long Island Chapter is thrilled to announce its 30th Anniversary and Membership Appreciation Event on Wednesday, May 15th, 2024, from 5:30 to 8:30 p.m. EST. The event will take place at Top Golf Long Island-Holtsville, promising an evening of camaraderie, celebration and fun-filled activities.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
SMTA Announces Program for High Reliability: Strategic Technology Advancement Research Forum
04/08/2024 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 2, 2024 in Olathe, Kansas, USA. The event, now in its second year, addresses challenges for electronics manufacturers in the high reliability sector.
SMTA Conducts First UHDI Symposium
03/29/2024 | Marcy LaRont, PCB007 MagazineSMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.