Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

ICT Spring Seminar: Nickel Not Welcome Here

03/12/2025 | Pete Starkey, I-Connect007
After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.

Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process

03/10/2025 | Multicircuits
Mike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.

EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection

02/20/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.

Designers Notebook: Addressing Future Challenges for Designers

02/06/2025 | Vern Solberg -- Column: Designer's Notebook
The printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.

DesignCon 2025, Day 2: It’s All About AI

01/30/2025 | Marcy LaRont, I-Connect007
It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in