Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
iNEMI PCB Warpage Characterization and Minimization Webinar
April 17, 2020 | iNEMIEstimated reading time: 1 minute
PCB Warpage Characterization and Minimization End-of-Project Webinar: May 13?14, 2020
The use of thinner components and thinner multi-up panel PCBs (? 40 mils) has exacerbated PCB warpage issues in SMT assembly which, in turn, can negatively impact PCB assembly yield.
iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The project analyzed the effects of:
- PCB post processing (bake & no bake PCB)
- Panel locations (corner & center)
- PCB thicknesses (0.8 mm & 0.6 mm)
- Material properties (mid Tg and high Tg)
- PCB fabrication processing
The resulting PCB warpage was evaluated using high temperature warpage measurement metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. The project team will report on the analysis of the results and recommendations.
Registration
This webinar is open to iNEMI members and non-members. Advance registration is required. Two sessions are scheduled; please click below to register for a session.
Session 1 (Americas and EMEA)
Wednesday, May 13
11:00 a.m.-12:00 p.m. EDT (North America)
5:00-6:00 p.m. CEST (Europe)
Register for webinar
Session 2 (APAC and Americas)
Thursday, May 14
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PST (North America) on Wednesday, May 13
Register for webinar
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms
08/27/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, announced the appointment of Mark Crebs to Products and Platform Director of Business Development.
VVDN Expands Manufacturing Footprint into the UAE to Meet Global Demand
08/20/2025 | PRNewswireVVDN Technologies, a global provider of software, product engineering and electronics manufacturing services & solutions, today announced it is setting up a new manufacturing facility in the UAE as part of its global expansion strategy.
SisTech Manufacturing Expands Services: Leading Precision in Electronic Manufacturing
08/11/2025 | Globe NewswireSisTech Manufacturing, known for its expertise in precision electronic manufacturing services, is expanding what it can do in production. For over 30 years, the company has been recognized for its commitment to quality and its ability to meet the diverse demands of industries like aerospace and consumer electronics. With ISO 9001:2015 certification and ITAR registration,
Kaynes Circuits to Invest $570 Million in PCB Tech India’s Tamil Nadu State
08/07/2025 | I-Connect007 Editorial TeamKaynes Circuits India, a subsidiary of Kaynes Technology India, announced on Aug. 4 that it plans to invest roughly $570 million over the next six years in the southern state of Tamil Nadu, the Economic Times reported.
Technica to Host Demo Days Event August 13-14
08/04/2025 | Technica USATechnica USA is proud to announce its upcoming Demo Days Event, taking place August 13–14 at the company’s Demo Center in San Jose, California. The event will feature live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.