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PCB Warpage Characterization and Minimization End-of-Project Webinar: May 13?14, 2020
The use of thinner components and thinner multi-up panel PCBs (? 40 mils) has exacerbated PCB warpage issues in SMT assembly which, in turn, can negatively impact PCB assembly yield.
iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The project analyzed the effects of:
- PCB post processing (bake & no bake PCB)
- Panel locations (corner & center)
- PCB thicknesses (0.8 mm & 0.6 mm)
- Material properties (mid Tg and high Tg)
- PCB fabrication processing
The resulting PCB warpage was evaluated using high temperature warpage measurement metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. The project team will report on the analysis of the results and recommendations.
Registration
This webinar is open to iNEMI members and non-members. Advance registration is required. Two sessions are scheduled; please click below to register for a session.
Session 1 (Americas and EMEA)
Wednesday, May 13
11:00 a.m.-12:00 p.m. EDT (North America)
5:00-6:00 p.m. CEST (Europe)
Register for webinar
Session 2 (APAC and Americas)
Thursday, May 14
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PST (North America) on Wednesday, May 13
Register for webinar
