-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Webinar May 5: Ensuring DDR4 Performance at Intended Data Rate
April 23, 2020 | Mentor, a Siemens businessEstimated reading time: 1 minute
DDR interfaces have many signal integrity and timing requirements that need to be guaranteed between multiple signal groups. Conformance to the requirements should be verified before a board is fabricated to reduce the chance of prototype spins. Traditionally, designers have relied on dedicated SI experts to perform this task or laid out boards based on manufacturer’s guidelines and skipped post-route verification entirely, hoping to avoid problems in the lab. Increasing data rates have pushed DDR operating margins to the point where simply following physical design rules is no longer enough to ensure that a design will work as intended.
This webinar by Mentor, a Siemens business, will be held twice on May 5, 2020: from 2-3 PM London time (UTC+1), and 2-3 PM Eastern time in the US. Presenter Min Maung will discuss the different electrical requirements associated with DDR designs and show how board and system designers can use HyperLynx to perform post-route verification themselves, helping free up scarce SI experts to focus on their company’s most challenging analysis problems.
What Attendees Will Learn
- DDR electrical requirements for signal integrity and timing
- Why “routing by the rules” isn’t enough anymore
- Why JEDEC specifications only give you half of the information you need
- How controller/DRAM configuration affects routing requirements
- How to use HyperLynx post-route verification to optimize margins for designs as routed
Who Should Attend
- PCB/system designers
- Engineering managers
- Signal integrity specialists
- PCB layout designers
To register for this web seminar, click here.
Suggested Items
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
WellPCB, OurPCB Launch Low-Cost PCB Assembly and Custom Cable Assembly Solutions
05/29/2025 | ACCESSWIREWellPCB and OurPCB, world leading PCB manufacturing service providers, announced today that they have officially launched new Low-Cost PCB Assembly Solutions and Custom Cable Assembly services to meet the needs of the electronics manufacturing industry for high cost performance and flexible customization.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.