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This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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Mentor Webinar May 5: Ensuring DDR4 Performance at Intended Data Rate
April 23, 2020 | Mentor, a Siemens businessEstimated reading time: 1 minute
DDR interfaces have many signal integrity and timing requirements that need to be guaranteed between multiple signal groups. Conformance to the requirements should be verified before a board is fabricated to reduce the chance of prototype spins. Traditionally, designers have relied on dedicated SI experts to perform this task or laid out boards based on manufacturer’s guidelines and skipped post-route verification entirely, hoping to avoid problems in the lab. Increasing data rates have pushed DDR operating margins to the point where simply following physical design rules is no longer enough to ensure that a design will work as intended.
This webinar by Mentor, a Siemens business, will be held twice on May 5, 2020: from 2-3 PM London time (UTC+1), and 2-3 PM Eastern time in the US. Presenter Min Maung will discuss the different electrical requirements associated with DDR designs and show how board and system designers can use HyperLynx to perform post-route verification themselves, helping free up scarce SI experts to focus on their company’s most challenging analysis problems.
What Attendees Will Learn
- DDR electrical requirements for signal integrity and timing
- Why “routing by the rules” isn’t enough anymore
- Why JEDEC specifications only give you half of the information you need
- How controller/DRAM configuration affects routing requirements
- How to use HyperLynx post-route verification to optimize margins for designs as routed
Who Should Attend
- PCB/system designers
- Engineering managers
- Signal integrity specialists
- PCB layout designers
To register for this web seminar, click here.
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Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Sondrel Announces Advanced Modelling Process for AI Chip Designs
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