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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Mentor Webinar May 26: Customizing DDR4 Designs for Cost and Performance
May 21, 2020 | Mentor, a Siemens businessEstimated reading time: 1 minute
Designers often rely on guidelines provided by controller vendors to drive PCB layout, but following those rules isn’t always possible. DDR layout guidelines can also drive up a board’s manufacturing costs, because they tend to be conservative. Dedicated SI experts have long used pre-layout simulation to develop their own layout rules that optimize design margin and cost for their particular applications, but SI experts are a scarce resource in most organizations.
This webinar will discuss the different design variables that can affect DDR design margin, and show how board and system designers can use HyperLynx pre-layout simulation to develop layout rules that will optimize design margins and minimize cost.
What Attendees Will Learn
- Designing a stackup to meet impedance requirements
- Balancing inter-trace spacing against impedance and crosstalk
- Balancing drive strength and inter-trace spacing against crosstalk
- Using simulation to derive board-level layout rules
- Predicting design operating margins before layout
- Optimizing drive strength and receiver ODT settings
Date/Time
Tuesday, May 26, 2020
2 PM US/Eastern
2 PM Europe/London
10 AM Asia/Singapore
To register, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.