Beyond Design: Integrated Circuit to PCB Integration
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
Quiet Power: An Evolution in PCB Design CostsMentor Webinar May 26: Customizing DDR4 Designs for Cost and Performance
May 21, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Designers often rely on guidelines provided by controller vendors to drive PCB layout, but following those rules isn’t always possible. DDR layout guidelines can also drive up a board’s manufacturing costs, because they tend to be conservative. Dedicated SI experts have long used pre-layout simulation to develop their own layout rules that optimize design margin and cost for their particular applications, but SI experts are a scarce resource in most organizations.
This webinar will discuss the different design variables that can affect DDR design margin, and show how board and system designers can use HyperLynx pre-layout simulation to develop layout rules that will optimize design margins and minimize cost.
What Attendees Will Learn
- Designing a stackup to meet impedance requirements
- Balancing inter-trace spacing against impedance and crosstalk
- Balancing drive strength and inter-trace spacing against crosstalk
- Using simulation to derive board-level layout rules
- Predicting design operating margins before layout
- Optimizing drive strength and receiver ODT settings
Date/Time
Tuesday, May 26, 2020
2 PM US/Eastern
2 PM Europe/London
10 AM Asia/Singapore
To register, click here.
Share on:
Suggested Items
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
09/11/2024 | StratEdgeStratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Sondrel Announces Advanced Modelling Process for AI Chip Designs
09/10/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.
Connect With a New Job at JobCONNECT007
09/10/2024 | I-Connect007 Editorial TeamjobCONNECT007 features job openings for positions that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you find that new gig. Once you find a position that’s a perfect fit, you can submit your resume directly to the hiring manager simply by clicking on the ad.