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Mentor Webinar May 26: Customizing DDR4 Designs for Cost and Performance
May 21, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Designers often rely on guidelines provided by controller vendors to drive PCB layout, but following those rules isn’t always possible. DDR layout guidelines can also drive up a board’s manufacturing costs, because they tend to be conservative. Dedicated SI experts have long used pre-layout simulation to develop their own layout rules that optimize design margin and cost for their particular applications, but SI experts are a scarce resource in most organizations.
This webinar will discuss the different design variables that can affect DDR design margin, and show how board and system designers can use HyperLynx pre-layout simulation to develop layout rules that will optimize design margins and minimize cost.
What Attendees Will Learn
- Designing a stackup to meet impedance requirements
- Balancing inter-trace spacing against impedance and crosstalk
- Balancing drive strength and inter-trace spacing against crosstalk
- Using simulation to derive board-level layout rules
- Predicting design operating margins before layout
- Optimizing drive strength and receiver ODT settings
Date/Time
Tuesday, May 26, 2020
2 PM US/Eastern
2 PM Europe/London
10 AM Asia/Singapore
To register, click here.
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Klaus Koziol - atgSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).