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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/07/2026 | Nolan Johnson, I-Connect007
Are you familiar with the “locus of control," which describes how much we believe our actions can change the outcome of our lives? Internal locus of control, for example, is the belief that our actions greatly shape our outcomes; external locus of control holds that external forces have a greater influence than our actions on how our lives play out. How we view our own locus of control can strongly influence how we respond to the world, perhaps even creating a self-fulfilling prophecy situation. The news has taken a more languid pace this week. Not so, however, for our intrepid band of I-Connect007 columnists, who thoughtfully tackle some chunky locus of control topics.

Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system.

Learning With Leo: Where Reliability Actually Hides

08/05/2026 | Leo Lambert -- Column: Learning With Leo
In my many years of training, it’s funny to see what still surprises people. For example, they’re surprised that by the time the solder melts, most of what decides whether that joint survives has already happened before the iron and even before inspection. In fact, it’s even earlier than that. In my column last month, I argued that most soldering problems are really problems of interpretation, which leads to the materials themselves, and where reliability is won or lost. So, let’s talk about what we’re actually soldering today.

Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.

Keiron Printing Technologies Raises €20.7M to Revolutionize LiFT Precision Solder Paste Printing for High-Reliability Electronics

07/22/2026 | Keiron Printing Technologies
Keiron Printing Technologies, the pioneer of Laser-Induced Forward Transfer (LiFT) precision solder paste printing, today announced it has closed a €20.7 million Series A round to end one of electronics manufacturing’s most expensive, unsolved problems – for good.
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