Elementary, Mr. Watson: High Power: When Physics Becomes Real
The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Z-Zero Webinar June 30: Eric Bogatin on Engineering the PDN
June 25, 2020 | Z-zeroEstimated reading time: 1 minute
Please join Z-Zero on Tuesday, June 30, 202 as Dr. Eric Bogatin, Dean of the Teledyne LeCroy Signal Integrity Academy at Be The Signal and author of the best-selling book Signal and Power Integrity—Simplified presents "Engineering the Power Distribution Network," the next event in this ongoing webinar series.
The power distribution network (PDN; sometimes also called the power delivery network) consists of all the interconnects from the voltage-regulator module (VRM) to the pads on the chip and the metallization on the die that locally distributes power and return current. This includes the VRM itself, the bulk decoupling capacitors, the vias, the traces, the planes on the circuit board, the additional capacitors added to the board, the solder balls or leads of the packages, the interconnects in the packages mounted to the board, the wire bonds or C4 solder balls, and the interconnects on the chips themselves.
The first and primary role of the PDN is to keep a constant supply voltage on the pads of the chips and to keep it within a narrow tolerance band, typically on the order of 5%. This voltage has to be stable, within the voltage limits, from DC up to the bandwidth of the switching current, typically above 1 GHz.
In this webinar, Dr. Bogatin will explore the entire PDN ecosystem, including both board and system-level tradeoffs.
EVENT: Engineering the Power Distribution Network
DATE: Tuesday, June 30, 2020
TIME: 10:00 AM - 11:30 AM Pacific Time
If you can't make the time slot, just register and you'll be notified when the slides/recording are available.
To register, or for more information, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.