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June 25, 2020 | Z-zeroEstimated reading time: 1 minute
Please join Z-Zero on Tuesday, June 30, 202 as Dr. Eric Bogatin, Dean of the Teledyne LeCroy Signal Integrity Academy at Be The Signal and author of the best-selling book Signal and Power Integrity—Simplified presents "Engineering the Power Distribution Network," the next event in this ongoing webinar series.
The power distribution network (PDN; sometimes also called the power delivery network) consists of all the interconnects from the voltage-regulator module (VRM) to the pads on the chip and the metallization on the die that locally distributes power and return current. This includes the VRM itself, the bulk decoupling capacitors, the vias, the traces, the planes on the circuit board, the additional capacitors added to the board, the solder balls or leads of the packages, the interconnects in the packages mounted to the board, the wire bonds or C4 solder balls, and the interconnects on the chips themselves.
The first and primary role of the PDN is to keep a constant supply voltage on the pads of the chips and to keep it within a narrow tolerance band, typically on the order of 5%. This voltage has to be stable, within the voltage limits, from DC up to the bandwidth of the switching current, typically above 1 GHz.
In this webinar, Dr. Bogatin will explore the entire PDN ecosystem, including both board and system-level tradeoffs.
EVENT: Engineering the Power Distribution Network
DATE: Tuesday, June 30, 2020
TIME: 10:00 AM - 11:30 AM Pacific Time
If you can't make the time slot, just register and you'll be notified when the slides/recording are available.
To register, or for more information, click here.
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