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Just Ask Happy: Resin-Filled Vias, Without Voids
September 9, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: What is the best way to resin-fill vias without voids?
A: I have not used this process a lot. In the past, partially filling surface vias with solder mask was sufficient. But now, with via-in-pad and stacked microvias, the filling process must be much more complete. Several machines on the market do this job very adequately and can be seen at the IPC APEX EXPO or SMTA International.
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