-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Sign Up For Mentor’s July 21 Webinar: FPGA-PCB Co-design
July 9, 2020 | Mentor, a Siemens businessEstimated reading time: 1 minute
Today’s leading-edge systems require a modern FPGA I/O optimization interface that enables you to quickly perform pin swapping and layout-based I/O optimization within the PCB design flow. Fact is, the lack of, or poor FPGA I/O optimization often leads to longer routing cycles and longer trace lengths which in turn result in the need for additional signal layers and vias which can impact signal integrity. A design tool flow with FPGA I/O Optimizer technology eliminates the barriers between FPGA and PCB designers and provides “correct-by-construction” FPGA I/O assignment allowing pin swapping and layout-based I/O optimization within the PCB process.
The ability to read in, export and synchronize FPGA designers’ HDL and constraint files ensures full consistency during the iterative concurrent design process. Incidentally, it also allows creating high pin count FPGA PCB parts ready for instantiation in minutes. Modern FPGA I/O optimization helps you not only accelerate design time-to-market, but also reduces manufacturing costs.
In this webinar by Mentor, a Siemens business, attendees will learn how modern FPGA I/O optimization can help you not only accelerate design time-to-market, but also reduce manufacturing costs.
What Attendees Will Learn
- How to create a multi-thousand pin FPGA part in minutes
- How to enable collaboration between FPGA and PCB designers
- How to optimize FPGA pin assignment in the context of the PCB layout
Who Should Attend
- Electrical engineers
- PCB designers
- Engineering managers
- Anyone interested in FPGA-PCB co-design
Date/Time
July 21, 2020
2-3 PM London Time
July 21, 2020
2-3 PM Eastern Time (US)
To register for this webinar or for more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.