-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Check Technology Solutions Partners with MIRTEC for Perfect 3D Inspection
July 20, 2020 | MirtecEstimated reading time: 1 minute

MIRTEC is pleased to announce that Check Technology Solutions has purchased an MV-6 OMNI 3D AOI machine to meet their ongoing commitment to flawless manufacturing quality. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable Check Technology Solutions to achieve 100% customer satisfaction.
“Check Technology Solutions is a leading manufacturer of microclimate control systems serving a variety of different industries including healthcare, food service, construction, agriculture, marine, motorcycle and aviation. The Company prides itself on being a US manufacturer, building high-quality innovative products. Originally founded in 1993 by the late Robert Check, the company reemerged in 2018 as Check Technology Solutions via an investment partnership between Check Corporation’s management and Sage Capital. Due to its outstanding inspection performance and intuitive programming software, our MV-6 OMNI 3D AOI machine has become a vital component in our defect detection capability allowing us to strive for 100% customer satisfaction,” Stated Bob Check, President of Check Technology Solutions.
“A growing number of manufacturers are relying upon MIRTEC’s Technologically Advanced 3D SPI and AOI solutions to help increase profitability by improving production yields and reducing costly rework.” said Brian D’Amico, President of MIRTEC Corp. “We are extremely pleased to have been awarded Check Technology’s 3D AOI business. We look forward to a long and prosperous relationship between our two organizations.”
MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.