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Are Our Stackup Rules No Longer Valid?

12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+
Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.

Liquid AI Raises $250M to Scale Capable and Efficient General-purpose AI

12/16/2024 | Liquid AI
Liquid AI announces a Series A round of financing with AMD Ventures as strategic lead.

Connect the Dots: Designing for Reality: Strip-Etch-Strip

12/05/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.

ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield

12/02/2024 | ZESTRON
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield” 

Betamek Berhad Secures MYR 396,420 Government Grant for Digital Transformation

11/27/2024 | Betamek
Betamek Berhad has accepted a government grant of MYR 396,420 from the Ministry of Entrepreneur and Cooperatives Development, managed by Malaysia Industrial Development Finance Berhad.
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