-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Samtec Teams With SnapEDA to Deliver Symbols and Footprints
July 28, 2020 | SnapEDAEstimated reading time: 1 minute
Samtec now has over 200,000 symbols and footprints for its products to accelerate the design process for engineers.
Engineers spend days creating digital models for each component on their circuit boards, such as symbols and footprints. Samtec and SnapEDA have teamed up to make these models readily available to engineers, because they both believe that engineers deserve the best in terms of ease-of-use, quality, and convenience.
In the second quarter of 2020, SnapEDA created over 120,000 new Samtec connector models, including high-speed and micro-pitch board-to-board, edge card, and rugged connectors. With these new connector models, engineers can now easily discover, and design-in Samtec products.
“Samtec is an inspiration when it comes to their dedication to the customer experience. Whether it’s their 24-hour free sample program, or their endless pursuit to expand the availability of design resources for their products, Samtec is truly world-class. These new models are yet another example of that dedication to their customers,” said Natasha Baker, CEO and founder of SnapEDA, based in San Francisco.
Connector models are highly sought-after by engineers, because they are incredibly time-consuming for which to create models. This is due to their non-standard bodies, custom solder stencils, fine pitches, irregular pad shapes, and cutouts. Accordingly, connectors are the third most popular category of components on SnapEDA.
“SnapEDA’s commitment to quality, innovation, and ease of doing business has made them a great partner for Samtec as well as our partners in the digital channel. They’ve enabled us to better serve our customers by offering quick and immediate access to hundreds of thousands of our most popular parts,” said Ashley Quinlan, Strategic Marketing Director at Samtec.
All models can be downloaded from Samtec’s website, samtec.com. They are also available on SnapEDA's site, snapeda.com, as well as through over a dozen of its collaborators including Digi-Key and Mouser Electronics.
Formats supported include Cadence OrCad, Allegro, Altium, Autodesk Eagle, Mentor PADS, KiCad, PCB123, and Proteus.
These new, high-quality models were created by SnapEDA’s Component Engineering team using proprietary, patented technology. They include accurate assembly, silkscreen, and contoured courtyards, and follow Samtec’s recommended PCB layouts and stencil patterns. Through-hole pads follow IPC-2221 standards using nominal drill hole sizes.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.