Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Just Ask Happy: Monitoring Via Reliability on a Lot-by-Lot Basis
July 29, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut by covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: What is the best way to monitor microvia reliability on a lot-by-lot basis for high-volume production?
A: What I recommend, and practice, is this: Do a thorough qualification of a fabricator using a HATS Qualification Panel (an IPC PCQRR-like panel) that includes an IPC D coupon resized for the runner on your SMT panel. Run these panel coupons through IPC-TM-650-2.6.27B and then TM-650-2.6.7.2 thermal cycles for 500 cycles. This is your baseline.
Then, by incorporating this smaller D coupon on all your boards’ assembly runners—requiring each lot to have a plating process control coupon for X number of solder float tests at 288°C and then microsections to look at TH quality—you have a way of comparing that lot’s performance to your initial qualification for that vendor. This should be redone each year and kept for records on each lot in case needed later.
To pose your own question for Happy Holden, take the survey by clicking here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.