Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Just Ask Happy: Monitoring Via Reliability on a Lot-by-Lot Basis
July 29, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut by covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: What is the best way to monitor microvia reliability on a lot-by-lot basis for high-volume production?
A: What I recommend, and practice, is this: Do a thorough qualification of a fabricator using a HATS Qualification Panel (an IPC PCQRR-like panel) that includes an IPC D coupon resized for the runner on your SMT panel. Run these panel coupons through IPC-TM-650-2.6.27B and then TM-650-2.6.7.2 thermal cycles for 500 cycles. This is your baseline.
Then, by incorporating this smaller D coupon on all your boards’ assembly runners—requiring each lot to have a plating process control coupon for X number of solder float tests at 288°C and then microsections to look at TH quality—you have a way of comparing that lot’s performance to your initial qualification for that vendor. This should be redone each year and kept for records on each lot in case needed later.
To pose your own question for Happy Holden, take the survey by clicking here.
Share on:
Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.