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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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inspectAR joins Cadence Design Systems
August 14, 2020 | inspectAREstimated reading time: Less than a minute
inspectAR has officially been acquired by Cadence Design Systems, the market leader in Electronic Design Automation software and services. inspectAR will continue to grow and operate independently from its headquarters in St. John’s, Newfoundland.
“For the past 1.5 years, inspectAR has been on a tear, adding immense value to hardware teams and engineers around the world,” says Mihir Shah, one of the inspectAR founders. “We’ve amassed thousands of users, teamed up with some of the biggest names in the industry, and built some of the most innovative technology to really bring a new lens into the hardware development space — and we’re just getting started.
The deal benefits inspectAR users in several ways, Mihir says.
“We are going to continue keeping the platform entirely vendor-agnostic, and adding support for even more EDA software and lab tools in the near future. Whether you use Cadence or another EDA tool to design PCB’s, we want to accelerate your hardware development. We now have far more resources to achieve our goals, and a far broader reach to get valuable insight from customers working in every part of the hardware sphere.”
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.