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Happy’s Tech Talk #34: Producibility and Other Pseudo-metrics

11/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
As an engineer, I thrive on data, and one of my favorite forms is metrics. However, the one metric that has always challenged me is producibility. I define this as more than just passing a DRC in CAM, but the entire envelope of “simplicity of design,” “suitability for test,” and many more. Yet, producibility seemed to be different for different engineers and we had no clear way to establish and define producibility other than opinion. When I worked at HP, the company invested in a methodology called design for manufacturing and assembly using the GE/Hitachi Methodology and Dewhurst-Boothroyd software. Finally, I had a methodology that created a producibility score.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

It’s Only Common Sense: Want to Succeed? Stay in Your Lane

10/28/2024 | Dan Beaulieu -- Column: It's Only Common Sense
In today’s busy world, there are so many things going on, that it’s easy to get distracted. We live in an era of constant comparison and nonstop disruption. Everyone’s talking about the latest technology, the economy’s twists and turns, globalization, or how Company X is doing something you’re not. But here’s the thing: None of that matters if you’re not focused on your path. I’m going to say it straight: Stay in your lane. It’s the only way you’ll ever find success in business and life.

Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1

10/25/2024 | I-Connect007
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.

The Cost-Benefit Analysis of Direct Metallization

10/21/2024 | Carmichael Gugliotti, MacDermid Alpha
Carmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
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